Product Description
N11P-GE1-W-A3 GPU NVIDIA GeForce G330M Part Number N11P-GE1-W-A3 Manufacturer NVIDIA BGA Alloy No Pb/Lead Free Date Code 1327 Package/Case 360 PCS Description Original new Technical Support BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING - NO WARRANTY BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125℃±5℃ x 24 hours or 80℃±5℃ x 48 hours Pay attention to the difference between leaded (Pb) balls and lead free (No Pb) balls. Lead-free/No Pb BGA chips: 245℃-260℃(Maximun) Leaded/Pb BGA chips: 180℃-205℃(Maximun)